Pixer Enables Technology For:
Mask Makers
- Tune your masks to meet required CD specifications and for optimal performance
- Yield improvement and fast turn-around on all mask types
- Achieve advanced CD Uniformity & MTT specifications
- Leverage existing installed mask manufacturing equipment
- Postpone purchasing additional advanced writing and etching tools
IC Manufacturers
- Improve your Lithography Process Window (PW) and overall productivity
- "Pellicle on" CD Uniformity improvement
- Extend the life of your installed base of scanners by improving the PW
- Improve yield on specific critical mask levels: dry and immersion lithography
- Improve chip binning: higher speed, lower leakage, etc.
CDC200 Value Proposition – Mask Makers
- The mask maker receives the CD uniformity specification from its customers
- Tighter CD uniformity requirements lower the mask manufacturing yield, and increase turn-around time
- The cost to reject mask to rewrite for non-compliant CDs is significant, and the impact on mask delivery times negatively impacts customer wafer starts
- Leading edge design rules have CD uniformity specifications that require heavy investment in new process tools to reach manufacturable yields
- Pixer’s CDC200 offers a cost-effective solution for all the above:
- Improves yield and turn-around time on high-end reticles
- Ability to achieve advanced CD Uniformity & MTT specifications
- Leverages existing installed mask manufacturing equipment
CDC200 Value Proposition – IC Manufacturers
- Poor CD uniformity negatively impacts the lithographic process:
- It can narrow the process window
- It can reduce litho productivity and yield (layer & device)
- It can reduce the chip reliability and bin splits
- It can increase chip power consumption
- Dealing with loose CDU is costly and time consuming:
- Order new reticle and wait for delivery
- Modify the litho process
- In extreme cases, make major resist or exposure tool changes
- CDC200 offers a cost-effective solution for all the above:
- Increases exposure latitude during litho processes
- Allows localized targeting of CDs for elimination of hot spots
- Improves gate leakage due to non-uniformity
- Improves EOL die yield and bin splits
