Pixer Enables Technology For:
Mask Makers
- Tune your masks to meet required CD specifications and for optimal performance
- Yield improvement and fast turn-around on all mask types
- Achieve advanced CD Uniformity & MTT specifications
- Leverage existing installed mask manufacturing equipment
- Postpone purchasing additional advanced writing and etching tools
IC Manufacturers
- Improve your Lithography Process Window (PW) and overall productivity
- "Pellicle on" CD Uniformity improvement
- Extend the life of your installed base of scanners by improving the PW
- Improve yield on specific critical mask levels: dry and immersion lithography
- Improve chip binning: higher speed, lower leakage, etc.
- 45 and 32 nm capable tool
- Production proven design with small foot print
- 100um cluster for advanced CD control applications (50 um optional)
- Fully automated operation
- SMIF loading standard
- Galileo transmission measurement/mapping system optional
Pixer’s CDC200 Specifications
| General | |
| Mask format (SEMI Standard) | 6/250 |
| Minimum feature | Not limited |
| Average Throughput (per mask) | 5-7hrs (1) |
| Mask Loading & unloading time-SMIF only | <5.0 min |
| Attenuation Correction Performance (2) | |
| Attentuation range | 0-3.0% |
| Attentuation uniformity (1σ ) | 0.1% |
| Attenuation resolution | Not limited |
| Correction unit size (discreet attenuation value) | 50 µm (3) |
| Transmission Measurement System | |
| Static repeatability (3σ) | 0.2% (4) |
| Dynamic reproducibility (3σ) | 0.40% (5) |
| Measurement time | <6 sec |
- Typical customer processing time @ 100 cm2 writing area
- Using CDC200 built-in transmission measurement unit & Pixer’s standard measurement procedure
- High Resolution option. Standard correction unit 100 um.
- 10 static measurements using Pixer’s standard measurement procedure
- 10 dynamic measurements using Pixer’s standard measurement procedure