February 24-25, 2009 in San Jose, California

In addition to being the industry’s first high speed, high-resolution DUV transmission metrology tool, Galileo has the ability to protect litho yields as a reticle requalification tool. Galileo has demonstrated its ability to detect haze-related transmission loss, while it is still a CD uniformity problem, rather than waiting for a defect-related yield crash. Galileo provides fabs a low cost of ownership, with typical reticle scan times of under an hour, and the ability to measure both single and multi-die reticles.

“In the past, traditional mask inspection methods identified haze only once it become a defect problem, resulting in CD yield declines,” said Steven Labovitz, Director of Strategic Marketing. “With Galileo, our customers are seeing an increase in their CD yields with the system’s ability to detect transmission degradation, due to haze, earlier in the manufacturing process.”

About Pixer Technology Ltd.
Pixer is a supplier of semiconductor capital equipment headquartered in Karmiel, Israel. It provides IC manufacturers and mask makers with solutions to correct, improve and selectively optimize the photolithography masks that are used in advanced semiconductor manufacturing processes. Pixer offers a unique revolutionary solution for improving the uniformity of Critical Dimensions on the mask, addressing one of the industry’s critical requirements for advanced chip manufacturing down to the 32 nm node and beyond.

Pixer Contact:
Mr. Bill Turnquist
VP, Sales and Marketing
Tel: 1-510-207-8937
Email: Bill@Pixertech.com

Mr. Ken Roberts
F23, Inc.
Tel: 1-925-256-8872
Email: kroberts@f23.com

The Pixer process, utilizing the CDC200, is enabling the ITRS Roadmap CD uniformity requirements for 45nm and 32nm today. Pixer’s customers are realizing world-class CD intrafield uniformity, with substantial improvements in EOL yield.

“This new processing center will provide customers in the Asia Pacific region with a fast, efficient and economical means to gain world class intrafield CD uniformity on critical layers, hence gaining an improved litho process window and an EOL yield improvement” says Bill Turnquist, VP of Sales and Marketing. “In addition, Pixer will now have an Asian demo center for its CDC200 and Galileo mask transmission mapping systems.”

About Pixer Technology Ltd.
Pixer is a supplier of semiconductor capital equipment headquartered in Karmiel, Israel. It provides IC manufacturers and mask makers with solutions to correct, improve, measure, map and selectively optimize the photolithography masks that are used in advanced semiconductor manufacturing processes. Pixer offers a unique revolutionary solution for improving the uniformity of Critical Dimensions on the mask, addressing one of the industry’s critical requirements for advanced chip manufacturing down to the 32 nm node and beyond.

Pixer Contact:
Mr. Bill Turnquist
VP, Sales and Marketing
Pixer Technology
Tel: 1-510-207-8937
Email: Bill@Pixertech.com

PR Contact:
Ken Roberts
F23, Inc.
Tel: 1-925-256-8872
Email: kroberts@f23.com

Pixer’s new US office is located at:
1551 McCarthy Blvd. #105
Milpitas, CA 95035

“Our new CDC200 is enabling the ITRS Roadmap CD uniformity requirements for 45nm and 32nm today. Our customers are realizing world-class CD uniformity, with substantial improvements in EOL yield,” said Steven Labovitz, director of strategic marketing at Pixer. “The CDC200 improves on the CDC101^™, providing a more robust production process in a smaller footprint.”

Pixer is also introducing Galileo, the industry’s first high speed, high resolution DUV metrology tool. Galileo, enables measurement of DUV transmission with a better than 0.1% resolution. Measurements can be made on both quartz and MoSi coated blanks. Of course, sensitivity does not come at the expense of speed: over 1000 sample points can be measured in under 20 minutes.

“With Galileo, we expect that blank manufacturers will be able to provide a higher quality mask blank to their leading-edge customers,” said Labovitz. “As photomask consumers push towards 45nm process nodes, transmission non-uniformity in the mask blank can account for up to 40% of the CD uniformity budget. Galileo will enable fabs to specify high uniformity blanks.”

About Pixer Technology Ltd.

Pixer is a supplier of semiconductor capital equipment headquartered in Karmiel, Israel. It provides IC manufacturers and mask makers with solutions to correct, improve and selectively optimize the photolithography masks that are used in advanced semiconductor manufacturing processes. Pixer offers a unique revolutionary solution for improving the uniformity of Critical Dimensions on the mask, addressing one of the industry’s critical requirements for advanced chip manufacturing down to the 32 nm node and beyond.

Contact:
Mr. Bill Turnquist
VP, Sales and Marketing
Pixer Technology
Tel: 1-510-207-8937
Click here to send an email
www.pixertech.com

• Typical power density >1010 W/cm2
• Typical plasma temp 105-106 k
• Plasma shock wave velocity- tens of km/sec
• Shock wave pressures - Mega bars

Step 1 - Shoot Laser Pulse at Sample
	Step 2 - Translate Sample & Snapshot in Time
Step 3 - Snapshot in Time - 100 fs	Step 4 - Snapshot in Time - 10 ps
Photon energy transferred to electrons	Photon energy transferred to ions
Step 5 - Snapshot in Time - 100 ps	Step 6 - Snapshot in Time - 10-100ns
Plasma expansion: most of the pulse energy reradiated as EM radiation	Shock wave propagation: some energy dissipated mechanically
Step 7 - Snapshot in Time - 1µs	Step 8 - Snapshot in Time - 1 ms
Thermal expansion: residual energy dissipated thermally	Permanent structural change - a pixel was formed