Pixer is a supplier of semiconductor capital equipment, focusing on innovative revolutionary lithography solutions that improve IC manufacturers and mask makers overall productivity and EOL yield.
Pixer provides both fabs and mask makers with solutions to measure, correct, improve, and selectively optimize the photolithography masks that are used to imprint an IC design onto wafers in the manufacturing process. Pixer develops and manufactures highly integrated systems based on its innovative optical laser and non-imaging optical technologies.
In addition Pixer has recently added a new revolutionary high sensitivity transmission measurement and mapping system for semiconductor masks based on it s proprietary non-imaging optics.
Core Technology
The The company’s core technology lies in the fields of femtolaser, optical element insertion into clear media (e.g. glass, quartz), physics, scanning algorithms, state-of-the-art optical instruments, non-imaging optics, etc.
Pixer’s Shade-In Element™ patented technology, used in its CDCTM tool, is using state-of the-art femtolaser to insert pixels into the reticle glass. These pixels affect the mask attenuation at the lithography process and translate into change in CD on the wafer surface.
Products & Applications
CDC200™ is an extension of the company’s first product, the CDC101 which is installed in a chip manufacturing sites and correcting day-to-day production masks. The tool offers on-the-fly CD Control capabilities used by customers in two main applications:
- CD Intrafield Uniformity improvement induced by masks or wafers
- Local Critical Dimension control (in a die)
Galileo™ is Pixer’s newest edition to its product line. Galileo is a non-imaging high sensitivity transmission mapping and measurement system for masks and is available as a stand alone tool or as an option on the CDC200.
CDC Value Proposition
Pixer’s CDC solution has been proven to benefit customers in multiple areas including:
- Improve EOL yield in advanced CD fabs (Improved fab productivity and yield)
- Improve the Lithography productivity by increasing the process latitude (Improved fab lithography productivity)
- Increased overall chip binning (Improved fab product performance and yield)
- Reclaim reject masks by bringing them into target CD specifications (Overall reticle cost Reduction and improved mask writing tool
Facilities
The corporate offices, demonstration facilities and engineer and development labs are located in Northern Israel, in Karmiel. The company recently made a significant investment in a new demo facility dedicated to customer demonstrations, production mask processing and other marketing & sales activities.
In addition the company has founded a US subsidiary, Pixer Technology Inc. in the heart of the Silicon Valley, CA. This is the home base of the Sales and Marketing team.